High-Speed Interconnect Technology for Servers

We are developing high-speed interconnect technology for servers to meet customers’ needs for transmitting huge amounts of data as quickly as possible. High-speed interconnect technology consists of high-speed I/O circuits and high-speed printed circuit boards (PCBs), and these technologies are optimized to achieve the target performance. This paper describes the architecture of I/O circuits that are part of efforts to develop high-speed transmission circuits. It also introduces the results of testing a prototype chip that was built to evaluate 20 Gb/s transmission. It goes on to describe efforts for improving PCB’s simulation accuracy so that high-speed signals can be sent stably. For accurate simulations, we think it is important to accurately evaluate each part that makes up the transmission line and reflect the results in a simulation model.